KB1-03

06.10(Wed) 11:25-12:05 国際会議場KB

  • simultaneous interpreting

Leading-edge AI infrastructure:
Challenges and Opportunities Through Silicon Innovation

Presented byAMD Japan Ltd.

The accelerating AI boom is fueling investment in the semiconductor market. As semiconductor design suitable for AI processing progresses, it is important to build AI models that utilize the latest semiconductor designs.
AI infrastructure is also evolving with cutting-edge semiconductors. On the other hand, usage conditions vary depending on the actual workload, whether it is cloud or on-premises, CPU or GPU.
AMD, whose mission is to achieve innovative R&D, time-to-market in line with market speed, and the trust and stability that are essential to infrastructure, and Toyota Systems Analysis Division, which supports the simulation of world-leading automotive development, will discuss the challenges and future of cutting-edge sites.

  • AI Infrastructure / Data Center
Speaker

AMD

CVP, Enterprise Business Group

Derek Dicker

Speaker

TOYOTA SYSTEMS CORPORATION

GM, Simulation Service Division, HPC Infrastructure Group 

Kenji Koshido

Speaker

AMD Japan Ltd.

Jon Robottom

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